Product Description

This passive component coupling system is used for mass production of automatic coupling of passive chip and FA  with high accuracy and excellent stability.

Product Features

The system realizes automatic coupling and testing of CWDM MUX&DEMUX components and UV glue pre-curing of components

Coupling between chip and FA automatically


The testing part realizes the IL/PDL index testing before and after glue curing to monitor the index change in the coupling process


Application
Main Specifications

微信图片_20230927162925.png

Data download